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光峰科技(688007)融资融券信息(02-25)-世界最大的城市

光峰科技(688007)融资融券信息(02-25)

K图 688007_0光峰科技(688007)2020-02-25融资融券信息显示,光峰科技融资余额74,128,612元,融券余额11,834,079.48元,融资买入额12,728,265元,融资偿还额12,619,767元,融资净买额108,498元,融券余量384,723股,融券卖出量69,328股,融券偿还量55,789股,融资融券余额85,962,691.48元。光峰科技融资融券详细信息如下表:交易日期代码简称融资融券余额(元)2020-02-25688007光峰科技85,962,691.48融资余额(元)融资买入额(元)融资偿还额(元)融资净买额(元)74,128,61212,728,26512,619,767108,498融券余额(元)融券余量(股)融券卖出量(股)融券偿还量(股)11,834,079.48384,72369,32855,789沪市全部融资融券数据一览 光峰科技融资融券数据

光峰科技(688007)融资融券信息(02-25)

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